10AX115H3F34I2LG vs 10AX115N3F45I2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115H3F34I2LG sa pamamagitan ng Intel at 10AX115N3F45I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115N3F45I2LG - Arria 10 GX FPGA, 1.15M LEs, 1932-FCBGA | Intel
10AX115N3F45I2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115H3F34I2LG | 10AX115N3F45I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LEs) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits | — |
| User I/O Count | 504 | — |
| Transceiver Count | 24 | — |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| DSP Blocks | Variable-precision, floating-point capable | Hardened floating-point (IEEE 754 single-precision) |
| DSP Performance | Up to 1.5 TFLOP/s (FP) | — |
| Hardened Memory Controllers | DDR4/DDR3/LPDDR3 | — |
| Hardened PCIe | PCIe Gen3 x8 | — |
| Hardened Ethernet MAC | 10G/40G/100G capable | — |
| Core Voltage | 0.9 V | 0.9 V (typical) |
| Process Node | 20 nm | — |
| Packhaging | 1152-ball FCBGA | 1932-BBGA, FCBGA (FC-FBGA) |
| Speed Grade | H3 | -2 |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial (I) |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| User I/O Pins | — | 768 |
| Process Technology | — | 20 nm |
| Transceivers | — | Up to 28.05 Gbps |
| Pin/Ball Count | — | 1932 |
| PCI Express Hard IP | — | Gen3 (integrated) |
| Memory | — | M20K block memory + MLAB |
| Configuration | — | JTAG / Active Serial (AS) |
| Uri ng Pagpapasok | — | Surface Mount |
| Lead-Free | — | Yes |