10AX115N4F45I3LG vs 10AX115N2F45I2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115N4F45I3LG sa pamamagitan ng Intel at 10AX115N2F45I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115N4F45I3LG - Arria 10 GX FPGA, 1150K LE, 1932-FCBGA | Intel
10AX115N4F45I3LG ✓ NakahandaIntel
10AX115N2F45I2LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
10AX115N2F45I2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115N4F45I3LG | 10AX115N2F45I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Device | 10AX115 | — |
| Logic Elements | 1,150,000 | 1,150,000 LE |
| Embedded Memory (bits) | 68,857,856 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| DSP Blocks | [DATA_NEEDED: DSP count] | — |
| User I/O Count | 768 | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | — |
| Process Technology | TSMC 20 nm | 20 nm |
| Packhaging | 1932-BBGA, FCBGA | 1932-ball FCBGA (N2F45) |
| Package Family | F45 (45 mm) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial (-40C to +100C case) |
| Speed Grade | I3 | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Terminal Form | Ball | Ball |
| Number of Terminals | 1932 | 1932 |
| Package Code | BGA (FCBGA) | — |
| Adaptive Logic Modules (ALMs) | — | 427,200 |
| Embedded Memory (Bits) | — | 68,857,856 bits |
| Embedded Memory (Mbit) | — | 52.99 Mbit |
| Maximum User I/O | — | 768 |
| Core Voltage | — | 0.9 V |
| Package Shape | — | Square |