10AX115N4F45I3LG vs 10AX115N3F45I2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115N4F45I3LG sa pamamagitan ng Intel at 10AX115N3F45I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115N4F45I3LG - Arria 10 GX FPGA, 1150K LE, 1932-FCBGA | Intel
10AX115N4F45I3LG ✓ NakahandaIntel
10AX115N3F45I2LG - Arria 10 GX FPGA, 1.15M LEs, 1932-FCBGA | Intel
10AX115N3F45I2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115N4F45I3LG | 10AX115N3F45I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Device | 10AX115 | — |
| Logic Elements | 1,150,000 | — |
| Embedded Memory (bits) | 68,857,856 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| DSP Blocks | [DATA_NEEDED: DSP count] | Hardened floating-point (IEEE 754 single-precision) |
| User I/O Count | 768 | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | Up to 28.05 Gbps |
| Process Technology | TSMC 20 nm | 20 nm |
| Packhaging | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA (FC-FBGA) |
| Package Family | F45 (45 mm) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial (I) |
| Speed Grade | I3 | -2 |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball | — |
| Number of Terminals | 1932 | — |
| Package Code | BGA (FCBGA) | — |
| Logic Elements (LE) | — | 1,150,000 |
| User I/O Pins | — | 768 |
| Pin/Ball Count | — | 1932 |
| Core Voltage | — | 0.9 V (typical) |
| PCI Express Hard IP | — | Gen3 (integrated) |
| Memory | — | M20K block memory + MLAB |
| Configuration | — | JTAG / Active Serial (AS) |
| Lead-Free | — | Yes |