10AX115R1F40E1SG vs 10AX115R2F40E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115R1F40E1SG sa pamamagitan ng Intel at 10AX115R2F40E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX115R1F40E1SG | 10AX115R2F40E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory | 68,857,560 bits (68.86 Mbit) | — |
| M20K Memory Blocks | [DATA_NEEDED: M20K count] | 2,128 |
| DSP Blocks | 342 | — |
| DSP Format | Variable-precision (fixed/floating-point) | — |
| Transceivers | [DATA_NEEDED: transceiver count for 10AX115 F40] | — |
| Transceiver Max Data Rate | 14.4 Gbps | — |
| Hard PCIe Cores | PCIe Gen3 x8 | — |
| Hard Memory Controllers | 2 | Yes |
| Maximum User I/O | 768 | — |
| Process Technology | 20 nm TSMC | 20 nm TSMC |
| Core Voltage | 0.9 V | — |
| Speed Grade | R1 (commercial) | -2 (E2, mid) |
| Temperature Grade | E1 (enhanced) | — |
| Packhaging | 1517-BBGA / FCBGA (F40), 40 x 40 mm | 1517-ball FCBGA, 40 x 40 mm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Tindminan RoHS | Compliant | — |
| Embedded Memory Bits | — | 68,857,856 |
| MLAB Memory Bits | — | 8,812,800 |
| Variable-Precision DSP Blocks | — | 1,518 |
| 18 x 19 Multipliers | — | 3,036 |
| PLLs | — | 16 |
| User I/O Pins | — | 342 |
| Transceiver Count | — | 48 (max 96 for the family) |
| Transceiver Data Rate | — | up to 17.4 Gbps (chip-to-chip) |
| PCIe Hard IP | — | Gen3 x1/x2/x4/x8 |
| Temperature na Operasyon | — | 0C to +100C (commercial) |
| RoHS | — | Compliant |