10AX115R3F40E2SG vs 10AX115R2F40E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115R3F40E2SG sa pamamagitan ng Intel at 10AX115R2F40E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115R2F40E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1517-FCBGA
10AX115R2F40E2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115R3F40E2SG | 10AX115R2F40E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | — |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | — |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | TSMC 20 nm |
| Speed Grade | -2 | -2 |
| Temperature Grade | E2 (0C to +100C) | E2 (Extended) |
| Packhaging | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-ball FCBGA (F40) |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 68,857,856 |
| Embedded Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| DSP Blocks (18x19 Multipliers) | — | 1,518 |
| User I/O Pins | — | 342 |
| Transceivers | — | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) |
| PCIe Hard IP | — | Gen3 x8 hard IP blocks |
| Memory Controllers | — | 2x hard DDR4/DDR3/RLDRAM3 controllers |
| PLLs | — | 24 fractional PLLs |