10AX115U2F45E2SG vs 10AX115U2F45I2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115U2F45E2SG sa pamamagitan ng Intel at 10AX115U2F45I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115U2F45E2SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
10AX115U2F45E2SG ✓ NakahandaIntel
10AX115U2F45I2LG - Arria 10 GX FPGA 1.15M LE | Intel | 1932-FCBGA
10AX115U2F45I2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115U2F45E2SG | 10AX115U2F45I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,560 | 68,857,856 bits |
| Embedded Memory Blocks | 2,134 M20K blocks (approx.) | — |
| DSP Blocks | 1,518 (variable-precision, hardened FP) | 1,518 |
| User I/Os | 480 | — |
| Transceivers | Up to 24 (GX, 12.5 Gbps) | — |
| PCIe Hard IP | Gen3 x8 | — |
| Memory Interfaces | DDR4, QDR-IV, RLDRAM3 | — |
| Process Node | 20 nm | — |
| Speed Grade | 2 | 2 (moderate) |
| Temperature Grade | E2 (industrial) | — |
| Packhaging | 1932-ball FCBGA (45 mm) | 1932-ball FCBGA (F45) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| User I/O Count | — | 480 |
| Transceiver Count | — | 24 |
| Transceiver Data Rate | — | Up to 12.5 Gbps |
| PCIe Hard IP Blocks | — | 4 (up to Gen3 x8) |
| Fractional PLLs | — | 8 |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.9 V |
| Package Body Size | — | 45 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |