10AX115U2F45I2LG vs 10AX115U3F45E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115U2F45I2LG sa pamamagitan ng Intel at 10AX115U3F45E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115U2F45I2LG - Arria 10 GX FPGA 1.15M LE | Intel | 1932-FCBGA
10AX115U2F45I2LG ✓ NakahandaIntel
10AX115U3F45E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1932-FCBGA
10AX115U3F45E2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115U2F45I2LG | 10AX115U3F45E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits | 68,857,856 |
| DSP Blocks | 1,518 | Variable-precision, 1.5 TFLOPs FP32 |
| User I/O Count | 480 | 480 |
| Transceiver Count | 24 | — |
| Transceiver Data Rate | Up to 12.5 Gbps | Up to 28.05 Gbps |
| PCIe Hard IP Blocks | 4 (up to Gen3 x8) | — |
| Fractional PLLs | 8 | — |
| Process Technology | 20 nm | 20 nm TSMC |
| Core Voltage | 0.9 V | — |
| Packhaging | 1932-ball FCBGA (F45) | — |
| Package Body Size | 45 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Speed Grade | 2 (moderate) | U3 (medium-performance, transceiver-focused) |
| Series | — | Arria 10 GX |
| Package Code | — | F45 (45 × 45 mm FCBGA) |
| Package Type | — | 1932-ball FCBGA (Flip-Chip BGA) |
| PCIe Hard IP | — | Gen3 x8/x16 |
| Memory Interfaces | — | DDR4, DDR3, QDR IV, RLDRAM 3 |
| Temperature na Operasyon | — | 0C to +100C (Industrial, E2 grade) |
| Configuration Method | — | SRAM-based, loaded via JTAG / AS / PS |
| Lead-Free / Halogen-Free | — | Yes / Yes |