10CL055YF484C6G vs 10CL055YF484C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10CL055YF484C6G sa pamamagitan ng Intel at 10CL055YF484C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10CL055YF484C6G | 10CL055YF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements (LE) | 55,856 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 156 | — |
| General-Purpose PLLs | 4 | — |
| Maximum User I/O | 321 | 321 |
| Packhaging | 484-ball FBGA (F484) | 484-FBGA (F484) |
| Speed Grade | -6 | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | — |
| Core Voltage | 1.2 V | 1.0 V |
| I/O Standards Supported | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V LVCMOS/LVTTL; LVDS | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| Process Technology | Low-power CMOS (TSMC) | 60 nm low-power CMOS |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Logic Elements | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits |
| DSP Blocks (18x18 Multipliers) | — | 156 |
| PLLs | — | 4 |
| Memory Blocks | — | 56 M9K |
| Operating Temperature Grade | — | Commercial (0 C to 85 C) |
| I/O Bank Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration | — | FPGA (SRAM-based, volatile) |