10CX150YF672I6G vs 10CX105YF672I6G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10CX150YF672I6G sa pamamagitan ng Intel at 10CX105YF672I6G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10CX150YF672I6G | 10CX105YF672I6G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone 10 GX | Cyclone® 10 GX |
| Logic Elements (LE) | 150,000 | 104,000 |
| Adaptive Logic Modules (ALM) | 54,770 | 3,800 ALM |
| Embedded Memory (bits) | 10,907,648 (6.6 Mb M20K + 4.6 Mb MLAB) | — |
| User I/O Pins | 236 | — |
| DSP Blocks | Variable-precision, 18x18 and 27x27 multipliers | — |
| Packhaging | 672-FCBGA (27x27 mm, 1.0 mm pitch) | 672-BBGA, FCBGA (F672) |
| Temperature na Operasyon | -40C to +100C (Industrial, 'I' suffix) | -40°C to +85°C (Industrial) |
| Speed Grade | 6 (fastest industrial) | 6 |
| Transceivers | Up to 6.144 Gbps multi-gigabit transceivers | — |
| Hard Memory Controllers | DDR3 with ECC, up to DDR3-1866 | — |
| Hard PCIe | PCIe Gen2 x4 | — |
| Process Node | 20 nm | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant | — |
| Embedded Memory | — | 7.46 Mbit |
| Embedded Memory Bits | — | 8,641,536 bits |
| Number of User I/Os | — | 236 |
| Operating Supply Voltage (Core) | — | 900 mV |
| Temperature Grade | — | Industrial (I) |
| Process Technology | — | TSMC 20 nm |
| Lead Free / RoHS | — | Yes (RoHS compliant) |
| Configuration Method | — | JTAG / AS / PS / FPP |