10CX150YF780E6G vs 10CX105YF780E5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10CX150YF780E6G sa pamamagitan ng Intel at 10CX105YF780E5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10CX150YF780E6G | 10CX105YF780E5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone 10 GX | — |
| Family | Cyclone 10 GX | Cyclone 10 GX |
| Process Technology | 20 nm | 20 nm |
| Logic Elements (LE) | 150,000 | — |
| Adaptive Logic Modules (ALM) | 56,480 | — |
| Embedded Memory | 10,907,648 bits (approximately 10.9 Mbit) | — |
| User I/O Pins | 284 | — |
| Packhaging | 780-ball FCBGA | 780-ball FCBGA (F780) |
| Speed Grade | -6 (E6G industrial fast) | 5 |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0 C to +100 C (commercial) |
| Transceivers | GX up to 12.5 Gbps | GX transceivers up to 12.5 Gbps |
| PCIe Hard IP | PCI Express Gen2 x4 hard IP | — |
| DSP Blocks | Variable-precision, fixed/floating point | — |
| Memory Interfaces | DDR3, DDR4, LPDDR3, QDR II+ | — |
| Uri ng Pagpapasok | Surface Mount (FCBGA) | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 105,000 |
| Adaptive Logic Modules (ALMs) | — | 38,000 |
| Embedded Memory (bits) | — | 8,641,536 (8.439 Mbit) |
| Number of User I/Os | — | 284 |
| Number of Logic Cells | — | 104,000 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage na Operasyon | — | 0.9 V (core) |
| Style ng Pagpapasok | — | SMD/SMT |