10M16DAF256I7G vs 10M25DAF256I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M16DAF256I7G sa pamamagitan ng Intel at 10M25DAF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M16DAF256I7G | 10M25DAF256I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | — |
| Logic Elements (LE) | 16000 | 25,000 |
| Embedded Memory Bits | 562176 | — |
| Embedded RAM (M9K) | 45 Kbits (45 x 9 Kbit blocks) | — |
| Maximum User I/O | 178 | — |
| I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Temperature na Operasyon | -40C to +100C (industrial) | -40 °C to +100 °C (Industrial) |
| Speed Grade | 7 (fastest) | 7 |
| Packhaging | 256-FBGA (17 x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA) |
| Configuration Memory | On-die flash (non-volatile, instant-on) | — |
| On-die ADC | 12-bit, 1 MSPS, up to 16 channels | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| Process Technology | 55 nm CMOS with embedded flash | 55 nm |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | MAX 10 |
| Embedded Memory | — | 691,200 bits (1,638 Kbit) |
| User I/Os | — | 178 |
| Core Voltage | — | 1.2 V (with 2.5 V analog supply) |
| Embedded Multipliers (18x18) | — | 45 |
| User Flash | — | 2,048 Kbit (2 KB per CFM block) |
| Integrated ADC | — | Yes, 12-bit SAR |
| Configuration Method | — | On-chip non-volatile flash (CFM) |
| Supply Configuration | — | Dual-supply (DAF sub-family) |