10M25DAF484C8G vs 10M25DCF484C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF484C8G sa pamamagitan ng Intel at 10M25DCF484C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M25DAF484C8G | 10M25DCF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Packhaging | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-BGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 °C to 85 °C (Commercial) | 0C to 85C |
| Speed Grade | -8 | -8 |
| Configuration Memory | On-chip dual-configuration flash | Internal flash (non-volatile) |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | MSL3 | [DATA_NEEDED: MSL level] |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Series | — | MAX 10 |
| Embedded Memory (Bits) | — | 691,200 |
| Number of I/O | — | 360 |
| Temperature Grade | — | Commercial (0C to 85C) |
| DSP Blocks (18x18 Multipliers) | — | [DATA_NEEDED: exact multiplier count for 10M25] |
| On-chip ADC | — | Yes (MAX 10 family feature) |
| Lead-Free | — | Yes |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT] |