10M50DAF256I7G vs 10M50DAF256C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF256I7G sa pamamagitan ng Intel at 10M50DAF256C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M50DAF256I7G | 10M50DAF256C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (M9K bits) | 1,677,312 | — |
| DSP Blocks (18 x 18 multipliers) | 4 | — |
| Maximum User I/O | 178 | — |
| Packhaging | 256-LBGA (17 mm x 17 mm) | 256-ball FBGA (F256) |
| Configuration Memory | Internal non-volatile flash (dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| PLLs | On-chip (4 typical for 10M50 family) | 4 |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Process Technology | TSMC 55 nm embedded flash | 55 nm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tray Quantity | 90 per tray (typical for 256-BGA) | — |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Mode | Internal flash (instant-on) | — |
| Logic Elements | — | 49,760 (50K) |
| Embedded Memory (bits) | — | 1,677,312 |
| User Flash (bits) | — | 1,677,312 |
| Maximum User I/Os | — | 178 |
| Multipliers (18x18) | — | 312 |
| Global Clock Networks | — | 20 |
| On-chip ADC | — | 12-bit, 1 MSPS, single or dual supply |
| Configuration | — | Internal flash (non-volatile, instant-on) |
| Speed Grade | — | C8 (8 ns) |
| Temperature Grade | — | Commercial (0C to +85C) |
| Level ng MSL | — | 3 (per JEDEC J-STD-20) |