5CGXBC7D6F27C7N vs 5CGXBC7D6F31C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC7D6F27C7N sa pamamagitan ng Altera at 5CGXBC7D6F31C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
5CGXBC7D6F27C7N - Cyclone V GX FPGA, 149.5K LE, 672-FBGA | Altera
5CGXBC7D6F27C7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CGXBC7D6F27C7N | 5CGXBC7D6F31C7N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone® V GX | Cyclone V GX |
| Family | Cyclone V GX (5CGXC7) | Cyclone® V GX |
| Logic Elements | 149,500 | — |
| Embedded Memory (bits) | 7,880,704 | — |
| Memory Blocks | M9K | — |
| DSP (18x18 Multipliers) | 156 | — |
| PLLs | 9 | — |
| Transceivers | Up to 12 channels at 3.125 Gbps | 8 channels up to 3.125 Gbps (6.144 Gbps capable) |
| PCIe Hard IP | PCIe Gen2 x4 | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Voltage (VCCA) | 0.85 V | — |
| Process Technology | TSMC 28 nm | 28 nm TSMC low-power |
| Packhaging | 672-BGA / FBGA | 896-BGA (FineLine BGA, F31) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0°C to +85°C (commercial) | 0°C to +85°C (Commercial) |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 149,500 |
| Embedded Memory | — | 7,880,704 bits |
| User I/O Count | — | 480 |
| DSP Blocks | — | 156 (18x18 multipliers) |
| Core Voltage | — | 1.1 V |
| Package Outline | — | 31 mm × 31 mm |
| Ball Pitch | — | 1.0 mm |
| Hard IP | — | PCIe Gen2 ×1/×2/×4, DDR3/LPDDR2 controller |