5CGXBC9E6F31C7N vs 5CGXBC7D7F31C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC9E6F31C7N sa pamamagitan ng Intel at 5CGXBC7D7F31C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 5CGXBC9E6F31C7N | 5CGXBC7D7F31C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V GX | Cyclone V GX |
| Logic Elements | 301,000 | — |
| Adaptive Logic Modules (ALMs) | 113,560 | — |
| Embedded Memory | 14,251,008 bits | — |
| Embedded Memory Blocks (M9K) | 1,720 | — |
| DSP Blocks (18x18) | 342 | 312 |
| Maximum User I/O | 480 | — |
| Transceivers | 12 (3.125 Gbps) | 9 (up to 3.125 Gbps) |
| PCIe Hard IP Blocks | 2 (Gen2 x1, x2, x4) | — |
| PLLs | 6 | 8 |
| Global Clock Networks | 12 | — |
| Process Node | 28 nm TSMC | TSMC 28 nm low-power |
| Core Supply Voltage (VCCINT) | 1.1 V | — |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Temperature na Operasyon | -40C to +85C (industrial) | 0 °C to +85 °C (commercial) |
| Packhaging | 896-pin FBGA (F31) | 896-ball FBGA, F31 (31 × 31 mm, 1.0 mm pitch) |
| Package Dimensions | 31 mm x 31 mm | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 149,500 |
| Embedded Memory (bits) | — | 7,880,704 |
| User I/O Pins | — | 480 |
| PCIe Hard IP | — | 2 × Gen2 endpoints |
| Core Voltage (VCC) | — | 1.1 V |
| Speed Grade | — | 8 (commercial) |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, JTAG, AES-256 encrypted |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |