5CSEBA2U23I7LN vs 5CSEBA2U23I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA2U23I7LN sa pamamagitan ng Intel at 5CSEBA2U23I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA2U23I7LN - Cyclone V SE SoC FPGA, 25K LE, ARM Cortex-A9 | Intel
5CSEBA2U23I7LN ✓ NakahandaIntel
5CSEBA2U23I7N - Cyclone V SE SoC, Dual ARM Cortex-A9, 25K LE | Intel
5CSEBA2U23I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA2U23I7LN | 5CSEBA2U23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 | 25,000 |
| HPS Cores | Dual ARM Cortex-A9 MPCore with NEON + FPU | — |
| Maximum HPS Clock Frequency | 925 MHz | — |
| Embedded Memory (M10K blocks) | 66 blocks (1,440 Kbits total) | — |
| Embedded Memory (MLAB) | [DATA_NEEDED: MLAB Kbits] | — |
| 18x18 Multipliers | 132 | — |
| PLLs | 4 (fractional) | — |
| Global Clock Networks | 20 | — |
| User I/O Banks | 8 | — |
| Maximum User I/O Pins | 364 | — |
| Packhaging | 672-pin UBGA (23x23 mm, 0.8 mm pitch) | 672-pin UBG A (23 mm x 23 mm) |
| Operating Temperature (Junction) | -40C to +100C (industrial, I7 grade) | — |
| Process Technology | TSMC 28 nm low-power | 28 nm low-power |
| Hard Memory Controller | DDR3 / DDR3L up to DDR3-1600 with ECC | — |
| HPS Peripherals | USB 2.0 OTG, Gigabit Ethernet, CAN, SPI, I2C, UART, SD/MMC, NAND flash | — |
| Lead-Free (L suffix) | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Hard Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | — | 800 MHz |
| Core Voltage | — | 1.1 V |
| Embedded Memory | — | 1.4 Mbits |
| DSP Blocks | — | Variable-precision DSP |
| User I/O Count | — | [DATA_NEEDED: exact user I/O count from datasheet] |
| I/O Banks | — | 8 |
| Memory Controller | — | DDR3 with ECC (hard IP in HPS) |
| Peripherals (HPS) | — | EMAC, USB, SPI, I2C, CAN, UART, SD/MMC |
| Temperature na Operasyon | — | -40C to +100C (industrial, 'I' suffix) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating from datasheet] |