5CSXFC5C6U23C6N vs 5CSXFC2C6U23C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSXFC5C6U23C6N sa pamamagitan ng Intel at 5CSXFC2C6U23C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSXFC5C6U23C6N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
5CSXFC5C6U23C6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSXFC5C6U23C6N | 5CSXFC2C6U23C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SX SoC FPGA | — |
| Logic Elements | 85,000 LE | 25K |
| Adaptive Logic Modules (ALMs) | 32,070 ALM | — |
| Embedded Memory | 3.88 Mbit | Approximately 1.4 Mbit |
| Number of User I/Os | 145 I/O | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Number of HPS Cores | 2 | — |
| HPS Maximum Clock Frequency | 925 MHz | — |
| L1 Cache (Instruction, per core) | 32 KB | — |
| L1 Cache (Data, per core) | 32 KB | — |
| Process Technology | TSMC 28 nm low-power | 28 nm TSMC low-power |
| Speed Grade | 6 | C6 |
| Temperature Grade | Commercial (0C to +85C) | — |
| Packhaging | 672-pin UBGA (23x23 mm), 0.8 mm ball pitch | 672-UBGA (U23), 23 mm x 23 mm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone V SX |
| Device Type | — | SoC FPGA (HPS + FPGA fabric) |
| Maximum HPS Clock Frequency | — | 925 MHz |
| DSP Blocks | — | 66 (18x18 multipliers) |
| User I/O Count | — | 224 |
| Ball Pitch | — | 0.8 mm |
| Supply Voltage (Core) | — | 1.1 V typical |
| Temperature na Operasyon | — | Commercial (0C to +85C) per 'C' suffix |
| Lead-Free | — | Yes |