5CSXFC5C6U23C6N vs 5CSXFC6C6U23C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSXFC5C6U23C6N sa pamamagitan ng Intel at 5CSXFC6C6U23C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSXFC5C6U23C6N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
5CSXFC5C6U23C6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSXFC5C6U23C6N | 5CSXFC6C6U23C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX |
| Logic Elements | 85,000 LE | 110,000 |
| Adaptive Logic Modules (ALMs) | 32,070 ALM | — |
| Embedded Memory | 3.88 Mbit | approximately 4,160 Kbits |
| Number of User I/Os | 145 I/O | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Number of HPS Cores | 2 | — |
| HPS Maximum Clock Frequency | 925 MHz | — |
| L1 Cache (Instruction, per core) | 32 KB | — |
| L1 Cache (Data, per core) | 32 KB | — |
| Process Technology | TSMC 28 nm low-power | 28 nm low-power |
| Speed Grade | 6 | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Packhaging | 672-pin UBGA (23x23 mm), 0.8 mm ball pitch | 672-UBGA (UFBGA) 23x23 mm |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | 3 (per JEDEC J-STD-020) | 3 (per typical BGA handling) |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone V SX SoC FPGA |
| Processor Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Fabric Frequency | — | 925 MHz |
| Core Supply Voltage | — | 1.1 V |
| Temperature na Operasyon | — | 0 C to +85 C (commercial) |
| Number of I/O | — | 145 (per JAK Electronics comparison) |
| DSP Blocks | — | approximately 112 |