5CSXFC5C6U23C8N vs 5CSXFC6C6U23C8NES Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CSXFC5C6U23C8N sa pamamagitan ng Intel at 5CSXFC6C6U23C8NES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
5CSXFC6C6U23C8NES 5CSXFC6C6U23C8NES - Cyclone V SX SoC FPGA 110K LE | Intel

5CSXFC6C6U23C8NES - Cyclone V SX SoC FPGA 110K LE | Intel

5CSXFC6C6U23C8NES ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro 5CSXFC5C6U23C8N 5CSXFC6C6U23C8NES
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone V SX Cyclone V SX
Device Variant 5CSXFC5 (5CSXC5 logic density) —
Logic Elements 85,000 110,000
Logic Array Blocks (LABs) 3,207 —
Maximum User I/O Pins 145 —
HPS Processor Cores Dual ARM Cortex-A9 MPCore —
HPS Maximum Frequency 600 MHz —
Process Technology 28 nm TSMC low-power —
Core Voltage 1.1 V —
Temperature na Operasyon 0 C to +85 C (commercial) —
Packhaging 672-pin UBGAFBGA (23x23 mm) 672-pin UBGА (23x23 mm)
Integrated Transceivers 3.125 Gbps —
Hard Memory Controller DDR3 (HPS side) —
Speed Grade C8 8 (commercial)
Lead-Free / RoHS Yes —
Device Type — SoC FPGA (FPGA + ARM Cortex-A9 HPS)
Hard Processor Subsystem — Dual ARM Cortex-A9 MPCore with CoreSight
HPS Clock Frequency (max) — 600 MHz
Process Node — 28 nm TSMC low-power
Embedded Memory (M10K + MLAB) — 5,140 Kbits (approx)
DSP Blocks (18x19 multipliers) — 112
User I/O Pins — 224
Temperature ng Junction na Operasyon — 0C to +85C (commercial)
External Memory Interfaces — DDR2, DDR3, LPDDR2
Hard PCIe Gen2 Controllers — 2
Uri ng Pagpapasok — Surface Mount (BGA)
Tindminan RoHS — Compliant

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