5CSXFC6D6F31I7N vs 5CSXFC5D6F31I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSXFC6D6F31I7N sa pamamagitan ng Intel at 5CSXFC5D6F31I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSXFC5D6F31I7N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9
5CSXFC5D6F31I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSXFC6D6F31I7N | 5CSXFC5D6F31I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA |
| Logic Elements | 110,000 | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz | 800 MHz |
| DSP Blocks (18x18 Multipliers) | 224 | — |
| Embedded Memory | approximately 5.5 Mbits | — |
| Maximum User I/O | 288 | — |
| Packhaging | 896-FBGA (31x31 mm) | 896-ball FBGA (31 x 31 mm) |
| Process Technology | 28 nm low-power | 28 nm low-power |
| Core Voltage | 1.1 V | 1.1 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40 C to +100 C (Industrial, TJ) |
| Uri ng Pagpapasok | Surface Mount (FBGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | 3 (per JEDEC J-STD-020, typical for BGA) |
| Series | Cyclone V SX 5CSXC6 (F31) | — |
| Package Pitch | — | 1.0 mm |
| Memory Interfaces | — | DDR2, DDR3, LPDDR2 |
| DSP Blocks | — | 18 x 18 multipliers |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, RSDS |
| Transceivers | — | Present (Cyclone V SX transceiver variants) |