A3P600-1FGG484 vs A3P600-FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-1FGG484 sa pamamagitan ng Microchip Technology at A3P600-FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-1FGG484 - 600K Gate ProASIC3 FPGA, 235 I/O | Microchip
A3P600-1FGG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-1FGG484 | A3P600-FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600,000 | 600K |
| Logic Elements / VersaTiles | 13824 | — |
| User I/O | 235 | — |
| Embedded Memory | 110592 | [DATA_NEEDED: embedded SRAM capacity] |
| Maximum System Frequency | 272 MHz | 231 MHz |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Speed Grade | -1 | — |
| Configuration Memory | Nonvolatile flash (single chip) | Flash-based (non-volatile, single chip) |
| I/O Banks | 4 | — |
| Packhaging | 484-ball FBGA (FGG484) | 484-Pin FBGA (FGG484) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature Range] | — |
| Tindminan RoHS | Compliant | Lead Free |
| Design Software | Microchip Libero SoC | — |
| Packaging | Tray | — |
| Core Supply Voltage | — | 1.5 V |
| User I/O Count | — | 235 |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |