A3P600-1FGG484I vs A3P600L-FGG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-1FGG484I sa pamamagitan ng Microchip Technology at A3P600L-FGG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600-1FGG484I - 600K Gate Flash FPGA 235 I/O | Microchip
A3P600-1FGG484I ✓ NakahandaMicrochip Technology
A3P600L-FGG484I - 600K Gate ProASIC3L FPGA | Microchip
A3P600L-FGG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-1FGG484I | A3P600L-FGG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | — |
| System Gates | 600000 | — |
| VersaTiles (D-flip-flops) | 13824 | — |
| User I/Os | 235 | 235 |
| Packhaging | 484-ball FBGA (FGG484) | — |
| Speed Grade | -1 | — |
| Core Voltage | 1.5 V | — |
| Technology | 130 nm flash process | — |
| Logic Architecture | VersaTile (LUT / D-flip-flop / latch) | — |
| Configuration Memory | On-chip flash (nonvolatile, single chip) | — |
| System Performance | Up to approx. 231 MHz (per Utmel family comparison) | — |
| I/O Banks | 4 (A3P600 per Microchip migration note) | — |
| Temperature na Operasyon | Industrial (-40C to +100C), I suffix | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Reprogrammability | Live reprogrammable (in-system) | — |
| Number of Dedicated RAM Blocks | [DATA_NEEDED: embedded memory blocks] | — |
| Max User Flash Memory | [DATA_NEEDED: embedded flash capacity] | — |
| DLL/PLL Resources | [DATA_NEEDED: clock conditioning resources] | — |
| Product Series | — | ProASIC3L |
| FPGA Family | — | Flash FPGA |
| Total System Gates | — | 600000 |
| Logic Elements | — | 13824 |
| Maximum System Performance | — | 350 MHz |
| Core Supply Voltage | — | 1.2 V to 1.5 V |
| Technology Node | — | 130 nm CMOS |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 mm x 23 mm |
| Package Height | — | 2.23 mm |
| Ball Pitch | — | 1 mm |
| Hanay ng Temperature na Operasyon | — | [DATA_NEEDED: industrial grade temperature range] |
| Tindminan RoHS | — | Compliant (Green) |
| Configuration | — | Non-volatile flash, instant-on |
| Low Power Mode | — | Flash*Freeze |