A3P600-2FGG144 vs A3P600L-1FGG144 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600-2FGG144 sa pamamagitan ng Microsemi at A3P600L-1FGG144 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600L-1FGG144 - 600K Gate Flash FPGA | Microchip Technology
A3P600L-1FGG144 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600-2FGG144 | A3P600L-1FGG144 |
|---|---|---|
| Brand | Microsemi | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3 | ProASIC3L |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | 1.2 V to 1.5 V |
| Program Technology | Nonvolatile Flash | — |
| Packhaging | 144-Ball FBGA (FGG144) | 144-LBGA (13x13mm, 1mm pitch) |
| Ball Pitch | 1 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Speed Grade | -2 | — |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (Green) |
| System Gates | — | 600000 |
| Logic Cells | — | 13824 |
| CLBs | — | 13824 |
| Maksimum na Taktiko ng Oras | — | 350 MHz |
| User I/Os | — | 97 |
| RAM Bits | — | 110592 |
| Technology | — | CMOS 130nm |
| Flash*Freeze | — | Yes |
| Bilang ng Pins | — | 144 |