A3P600L-1FGG484 vs A3P600-FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600L-1FGG484 sa pamamagitan ng Microchip Technology at A3P600-FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600L-1FGG484 - 600K Gate Flash FPGA | Microchip | FBGA-484
A3P600L-1FGG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600L-1FGG484 | A3P600-FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3 |
| Total Gates | 600000 | — |
| Logic Cells (CLBs) | 13824 | — |
| Maksimum na Taktiko ng Oras | 350 MHz | — |
| Core Supply Voltage | 1.2 V | 1.5 V |
| I/O Count | 235 | — |
| RAM Bits | 110592 | — |
| Packhaging | 484-FBGA (23x23 mm, 1.00 mm pitch) | 484-Pin FBGA (FGG484) |
| Technology | 130 nm CMOS | — |
| Flash*Freeze Current | 5 mA (typical) | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (Green) | Lead Free |
| Terminal Pitch | 1.00 mm | — |
| Height | 2.23 mm | — |
| System Gates | — | 600K |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm CMOS |
| User I/O Count | — | 235 |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |