A3PE3000-1FGG324I vs A3PE3000-FGG324 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-1FGG324I sa pamamagitan ng Microchip Technology at A3PE3000-FGG324 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG324I ✓ NakahandaMicrochip Technology
A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip
A3PE3000-FGG324 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-1FGG324I | A3PE3000-FGG324 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E (Flash-based FPGA) | ProASIC3E |
| System Gates | 3,000,000 | 3000000 gates |
| User I/Os (this package) | 221 | — |
| Max User I/Os (family) | 616 | — |
| Embedded SRAM | 504 kbits true dual-port | — |
| Supply Voltage (core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Configuration | Flash-based, Live-at-Power-Up Level 0, single-chip | — |
| Soft CPU Support | Optional soft ARM support | — |
| Packhaging | 324-BGA FBGA (19x19 mm, 1 mm pitch) | 324-Ball FBGA (FGG324) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (TJ) | [DATA_NEEDED: Operating Temperature] |
| Number of Gates | 3,000,000 | — |
| Speed Grade | -1 | — |
| Packaging | Tray | — |
| Tindminan RoHS | ROHS3 Compliant | Green (compliant) |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Cells | — | 75264 cells |
| Number of I/O | — | 221 |
| Core Supply Voltage | — | 1.425 V to 1.575 V |
| Maximum System Frequency | — | 231 MHz |
| Embedded Flash Bits | — | 516096 bits |
| Configuration Type | — | Flash (nonvolatile, single-chip) |
| Package Dimensions | — | 19 x 19 mm, 1.63 mm height, 1 mm pitch |
| Soft ARM Support | — | Yes (optional soft ARM core support) |
| Technology Node Family | — | CMOS flash FPGA |