A3PE3000-2FGG484I vs A3PE3000L-1FG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-2FGG484I sa pamamagitan ng Microchip Technology at A3PE3000L-1FG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-2FGG484I - 3M-Gate Flash FPGA 341 I/O BGA-484 | Microchip
A3PE3000-2FGG484I ✓ NakahandaMicrochip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-2FGG484I | A3PE3000L-1FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Logic Cells | 75264 | — |
| System Gates | 3000000 | 3,000,000 gates |
| User I/O | 341 | — |
| Family | ProASIC3E (Flash) | ProASIC3L (Low Power Flash FPGA) |
| Configuration Memory | Nonvolatile on-chip Flash | — |
| Speed Grade | -2 | -1 |
| Packhaging | 484-Ball FBGA | 484-ball FBGA (FG484) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (Industrial, I suffix) | [DATA_NEEDED: exact min/max operating temperature range] |
| Programming | In-system, live field upgrade | — |
| Soft Processor Support | Optional soft ARM support | — |
| Configuration Bits | 516096 | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM capacity] | — |
| Core Supply Voltage | [DATA_NEEDED: Core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage range] | — |
| PLLs | [DATA_NEEDED: Number of PLLs] | — |
| Tindminan RoHS | Compliant (green package per manufacturer data) | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements (LEs) | — | 35 KLEs |
| Total RAM Bits | — | 516096 bits |
| Number of I/O | — | 341 |
| Core Voltage | — | 1.2 V (family supports 1.2 V to 1.5 V) |
| Process Technology | — | 130 nm flash |
| Special Features | — | Flash*Freeze technology, non-volatile single-chip |
| Terminal Form | — | Ball (BGA, square) |
| Temperature Grade | — | Industrial (I) |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Configuration | — | On-chip flash, no external boot device |
| Packaging | — | Tray |