A3PE3000L-1FG484 vs A3PE3000L-FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FG484 sa pamamagitan ng Microchip Technology at A3PE3000L-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FG484 ✓ NakahandaMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FG484 | A3PE3000L-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3000000 |
| Logic Cells / CLBs | 75264 | 75264 |
| Logic Elements (LEs) | [DATA_NEEDED: LE count] | — |
| User I/O | 341 | — |
| Embedded Memory | 516096 bits | [DATA_NEEDED: Embedded RAM block capacity] |
| Core Voltage | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | — |
| Packhaging | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| Special Features | Flash*Freeze technology, live reprogrammability | — |
| Tindminan RoHS | Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) | [DATA_NEEDED: RoHS compliance] |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Supply Voltage - I/O | [DATA_NEEDED: I/O voltage range] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Package Height | 2.23 mm | 2.23 mm |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Configuration | — | Flash-based, Instant On, single-chip |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |