A3PE3000L-1FGG896 vs A3PE3000-1FGG896 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-1FGG896 sa pamamagitan ng Microchip Technology at A3PE3000-1FGG896 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ NakahandaMicrochip Technology
A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip
A3PE3000-1FGG896 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-1FGG896 | A3PE3000-1FGG896 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L | ProASIC3E (Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells | 75264 | 75,264 |
| User I/O | 620 | 620 |
| Total Bits of RAM | [DATA_NEEDED: Total embedded RAM bits] | — |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) | [DATA_NEEDED: core voltage] |
| I/O Voltage | As low as 1.2 V | — |
| Speed Grade | -1 | -1 |
| Process Technology | 130 nm flash | — |
| Configuration Memory | Nonvolatile flash (single-chip) | — |
| Special Features | Flash*Freeze technology | — |
| Packhaging | 896-ball FBGA (FGG896), 1.00 mm pitch | 896-ball FBGA (FGG896) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Terminal Pitch | 1.00 mm | — |
| Technology Base | CMOS flash | — |
| Dynamic Power Reduction vs ProASIC3 | Approx. 40% | — |
| Static Power Reduction vs ProASIC3 | Approx. 50% | — |
| Technology | — | Nonvolatile flash, CMOS |
| Configuration | — | Single-chip, Instant On (on-chip flash) |
| Reprogrammability | — | Yes (in-system reprogrammable flash fabric) |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| Embedded Memory | — | [DATA_NEEDED: embedded block RAM capacity] |
| Lead Free | — | Yes (LEAD FREE per distributor listing) |
| Tindminan RoHS | — | Compliant |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Country of Origin | — | South Korea (per MicrochipDirect for A3PE3000-1FG896 family variant) |