A3PE3000L-FG324I vs A3PE3000L-FG324 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FG324I sa pamamagitan ng Microchip Technology at A3PE3000L-FG324 sa pamamagitan ng Microsemi. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
A3PE3000L-FG324I A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip

A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip

A3PE3000L-FG324I ✓ Nakahanda
Microsemi
A3PE3000L-FG324 A3PE3000L-FG324 - 3M-Gate ProASIC3EL Flash FPGA | Microsemi

A3PE3000L-FG324 - 3M-Gate ProASIC3EL Flash FPGA | Microsemi

A3PE3000L-FG324 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro A3PE3000L-FG324I A3PE3000L-FG324
Brand Microchip Technology Microsemi
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family ProASIC3L (Flash-based FPGA) ProASIC3EL (ProASIC3E Low Power)
System Gates 3,000,000 3000000
Logic Cells (CLBs) 75264 —
User I/O 221 221
Embedded SRAM 516096 bits (up to 144 kbits true dual-port blocks per family) —
Core Voltage 1.2 V (1.2 V to 1.5 V supported) 1.2 V (supports 1.2 V to 1.5 V)
Process Technology 130 nm CMOS, 7-layer metal (6 copper), flash-based 130 nm CMOS flash
Configuration Nonvolatile flash, Instant On (Level 0 support) —
Low Power Feature Flash*Freeze technology —
Max Frequency [DATA_NEEDED: maximum system frequency] —
JTAG Boundary Scan IEEE 1149.1 —
Input Option Schmitt Trigger on single-ended inputs —
Packhaging 324-ball FBGA (FG324), 19x19 mm 324-ball FBGA
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon -40C to +100C (Industrial, I suffix) [DATA_NEEDED: Operating Temperature]
Tindminan RoHS Non-Compliant (FG package contains lead) RoHS Non-Compliant (contains lead, FG variant)
Lead Free Status Contains Lead Contains Lead (FG variant); choose FGG variant for lead-free
Configuration Memory — On-chip flash (non-volatile, single chip)
Max Reported Frequency (parameter listing) — 781.25 MHz (per FindIC parameter data)
Embedded Memory — [DATA_NEEDED: Embedded Memory]
DLL/PLL Blocks — [DATA_NEEDED: DLL/PLL Blocks]
Level ng MSL — [DATA_NEEDED: MSL Level]
Programming Method — In-system / on-board flash programming

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