A3PE3000L-FGG896M vs A3PE3000-1FGG896 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FGG896M sa pamamagitan ng Microchip Technology at A3PE3000-1FGG896 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FGG896M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FGG896M ✓ NakahandaMicrochip Technology
A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip
A3PE3000-1FGG896 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FGG896M | A3PE3000-1FGG896 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3E (Flash FPGA) |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 |
| User I/Os | Up to 616 (620 per DigiKey listing) | — |
| Embedded SRAM | 504 kbits true dual-port | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Voltage | 1.2 V to 1.5 V | [DATA_NEEDED: core voltage] |
| Volte ng Pagbibigay | 1.5 V | — |
| Packhaging | 896-ball FBGA (FGG896), 1 mm pitch | 896-ball FBGA (FGG896) |
| Logic Family | CMOS | — |
| Temperature na Operasyon | 0 to 70 C | [DATA_NEEDED: operating temperature range] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration | Non-volatile flash, live-at-power-up Level 0, single-chip | Single-chip, Instant On (on-chip flash) |
| Low-Power Feature | Flash*Freeze technology | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Input Features | Schmitt trigger option on single-ended inputs; weak pull-up/pull-down | — |
| User I/O | — | 620 |
| Speed Grade | — | -1 |
| Technology | — | Nonvolatile flash, CMOS |
| Reprogrammability | — | Yes (in-system reprogrammable flash fabric) |
| Embedded Memory | — | [DATA_NEEDED: embedded block RAM capacity] |
| Lead Free | — | Yes (LEAD FREE per distributor listing) |
| Tindminan RoHS | — | Compliant |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Country of Origin | — | South Korea (per MicrochipDirect for A3PE3000-1FG896 family variant) |