A3PE600-1FGG484 vs A3PE600-FG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE600-1FGG484 sa pamamagitan ng Microchip Technology at A3PE600-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
A3PE600-1FGG484 ✓ NakahandaMicrochip Technology
A3PE600-FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE600-1FGG484 | A3PE600-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E | ProASIC3E (Flash FPGA) |
| System Gates | 600000 | 600000 |
| Logic Cells / CLBs | 13824 | — |
| User I/Os (this package) | 270 | — |
| Max User I/Os (family) | 616 | — |
| Embedded SRAM | 110592 bits (504 kbits true dual-port max per family data) | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Configuration Memory | On-chip flash, live at power-up (Level 0) | — |
| Speed Grade | -1 | — |
| Temperature na Operasyon | 0 C to +85 C (TJ) | [DATA_NEEDED: operating temperature range] |
| Packhaging | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Tindminan RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | — |
| Reprogrammability | Yes, single-chip solution, no external boot device | — |
| Logic Cells (CLBs) | — | 13824 |
| User I/Os | — | 270 |
| Embedded Memory | — | 110592 |
| Maximum System Frequency | — | 231 MHz |
| Core Voltage | — | 1.5 V |
| Technology | — | 130 nm CMOS flash |
| Package Height | — | 2.23 mm |
| Configuration | — | Nonvolatile flash (single-chip, no external configuration PROM) |
| Package Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Soft Processor Support | — | Soft ARM support |