A3PE600-FG484I vs A3PE600-1FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE600-FG484I sa pamamagitan ng Microchip Technology at A3PE600-1FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE600-FG484I - ProASIC3E FPGA 600K Gates 484-FBGA | Microchip
A3PE600-FG484I ✓ NakahandaMicrochip Technology
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
A3PE600-1FGG484 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE600-FG484I | A3PE600-1FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Logic Cells | 13824 cells | — |
| Usable LEs | 7 KLEs | — |
| System Gates | 600000 gates | 600000 |
| Embedded RAM Bits | 110592 bits | — |
| User I/O | 270 | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.425 V to 1.575 V (1.5 V nominal) |
| Configuration Technology | Flash-based (non-volatile, single chip) | — |
| Packhaging | 484-FBGA (23 x 23 mm, 1 mm ball pitch) | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| Temperature na Operasyon | -40C to +100C (TJ) | 0 C to +85 C (TJ) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Tindminan RoHS | Non-compliant | ROHS3 Compliant |
| Manufacturer Lead Time | 8 weeks | 8 weeks |
| Product Status | Active | Active |
| Family | ProASIC3E | ProASIC3E |
| Logic Cells / CLBs | — | 13824 |
| User I/Os (this package) | — | 270 |
| Max User I/Os (family) | — | 616 |
| Embedded SRAM | — | 110592 bits (504 kbits true dual-port max per family data) |
| Configuration Memory | — | On-chip flash, live at power-up (Level 0) |
| Speed Grade | — | -1 |
| Reprogrammability | — | Yes, single-chip solution, no external boot device |