AFS600-FG256K vs AFS600-1FG256K Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-FG256K sa pamamagitan ng Microchip Technology at AFS600-1FG256K sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-FG256K ✓ NakahandaMicrochip Technology
AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256K ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-FG256K | AFS600-1FG256K |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| System Gates | 600,000 system gates | — |
| Logic Cells | 13,824 logic cells | 13,824 logic cells |
| Device Type | Fusion mixed-signal FPGA | Fusion mixed-signal field-programmable gate array (FPGA) |
| Programmable Logic | Flash-based CMOS programmable logic | Flash-based programmable logic |
| Configuration Technology | Nonvolatile flash configuration | — |
| Power-Off Retention | Program retained when powered off | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Process Technology | 130 nm CMOS | — |
| Metal Layers | 7 metal layers | — |
| Logic Family | CMOS | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Hanay ng Temperature na Operasyon | 0°C to 70°C | [DATA_NEEDED: operating temperature range] |
| Package Type | BGA-256, 1.0 mm pitch | — |
| Bilang ng Pin | 256 pins | — |
| Uri ng Pagpapasok | Surface mount | Surface mount |
| ARM Support | Optional ARM support in the Fusion family | — |
| Equivalent System Gates | — | 600,000 gates |
| User I/O | — | 119 I/O |
| Maximum Frequency | — | 1282.05 MHz |
| Core Supply Voltage | — | 1.5 V |
| Integrated Analog | — | Configurable analog resources |
| Embedded Memory | — | Large flash memory blocks |
| Clock Management | — | Comprehensive clock generation and management circuitry |
| Packhaging | — | 256-terminal plastic ball grid array (256-LBGA) |
| Terminal Count | — | 256 terminals |
| Package Shape | — | Square |
| Terminal Pitch | — | 1.00 mm |
| Package Dimensions | — | 17 mm x 17 mm |
| Ordering Package Option | — | Tray |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |