ATMEGA88A-MU vs ATMEGA88A-MUR Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATMEGA88A-MU sa pamamagitan ng Microchip Technology at ATMEGA88A-MUR sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATMEGA88A-MU - 8-bit AVR MCU, 8KB Flash 20MHz | Microchip (Tape & Reel)
ATMEGA88A-MU ✓ NakahandaMicrochip Technology
ATMEGA88A-MUR - 8-bit AVR MCU, 8KB Flash 20MHz | Microchip
ATMEGA88A-MUR ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATMEGA88A-MU | ATMEGA88A-MUR |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | 8-bit AVR RISC | 8-bit AVR RISC |
| Program Memory Size | 8 KB (4K x 16) Flash | 8 KB (4K x 16) Flash |
| EEPROM Size | 512 B | 512 B |
| SRAM Size | 1 KB | 1 KB |
| Maximum Clock Speed | 20 MHz | 20 MHz |
| Supply Voltage Range | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| General Purpose I/O | 23 I/O lines | 23 I/O lines |
| Working Registers | 32 x 8-bit | 32 x 8-bit |
| ADC Resolution | 10-bit, 8 channels | 10-bit, 8 channels |
| Timers/Counters | Two 8-bit, one 16-bit | Two 8-bit, one 16-bit |
| Communication Interfaces | USART, SPI, TWI (I2C-compatible) | USART, SPI, TWI (I2C-compatible) |
| Packhaging | 32-VQFN (5x5 mm) with exposed pad | 32-VQFN (5x5 mm) with exposed pad |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Sleep Modes / Power Technology | picoPower, multiple sleep modes | picoPower, multiple sleep modes |
| Tindminan RoHS | Compliant (green package) | Compliant (green package) |
| Debug / Programming | ICSP via MPLAB SNAP (debugWIRE) | ICSP via MPLAB SNAP (debugWIRE) |
| Package Pitch | [DATA_NEEDED: package pitch] | [DATA_NEEDED: package pitch] |