ATSAM4SD32BA-UUR vs ATSAM4SD32BB-MNR Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAM4SD32BA-UUR sa pamamagitan ng Microchip Technology at ATSAM4SD32BB-MNR sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAM4SD32BA-UUR - 2MB Flash Cortex-M4 MCU 64-WLCSP | Microchip
ATSAM4SD32BA-UUR ✓ NakahandaMicrochip Technology
ATSAM4SD32BB-MNR - SAM4S Cortex-M4 120MHz 2MB MCU 64-QFN | Microchip
ATSAM4SD32BB-MNR ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAM4SD32BA-UUR | ATSAM4SD32BB-MNR |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | ARM Cortex-M4 with FPU and DSP | ARM Cortex-M4F (with FPU) |
| Core Frequency | 120 MHz max | 120 MHz |
| Flash Memory | 2 MB (2048 KB) | 2 MB (2048 KB, dual-bank) |
| SRAM | 160 KB | 160 KB |
| Instruction Cache | 2 KB | — |
| Data Cache | 1 KB | — |
| Core Supply Voltage | 1.08 V to 1.32 V (1.2 V typ) | — |
| I/O Supply Voltage | 1.62 V to 3.6 V | — |
| Temperature na Operasyon | -40 C to +85 C (industrial) | -40C to +85C (Industrial) |
| Packhaging | 64-ball WLCSP (4.42 mm x 3.42 mm) | 64-QFN (9x9 mm) with exposed thermal pad |
| ADC | 12-bit, up to 24 channels | 12-bit, up to 1 Msps, up to 16 channels |
| DAC | 12-bit, 1 channel | — |
| USB | USB 2.0 FS Device + 2x HS Host ports | — |
| CAN | 2x CAN 2.0A/B controllers | — |
| Timers | 4x 16-bit TC + 1x PWM controller | 16-bit and 32-bit timers, RTC, PWM |
| Communication | 3x USART, 2x UART, 2x TWI (I2C), 2x SPI, 1x SSC, 1x HSMCI | — |
| External Bus Interface | 16-bit EBI for SRAM/NOR/NAND | — |
| Performance | 150 DMIPS (1.25 DMIPS/MHz) | 150 DMIPS / 1.25 DMIPS/MHz |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (WLCSP) | Surface Mount |
| Operating Voltage | — | 1.62 V to 3.6 V |
| Communication Interfaces | — | USB 2.0 FS device, 2x CAN-FD, EMAC (RMII), up to 5x USART, 5x UART, 3x SPI, 2x TWI (I2C) |
| DMA Channels | — | 24 (PDC + DMAC) |
| Level ng MSL | — | MSL3 (per JEDEC J-STD-020) |
| Silicon Revision | — | B (recommended for new designs per Microchip) |