ATSAMA5D22B-CU vs ATSAMA5D21B-CU Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D22B-CU sa pamamagitan ng Microchip Technology at ATSAMA5D21B-CU sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAMA5D22B-CU - 500MHz ARM Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22B-CU ✓ NakahandaMicrochip Technology
ATSAMA5D21B-CU - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip
ATSAMA5D21B-CU ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAMA5D22B-CU | ATSAMA5D21B-CU |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Processor | ARM Cortex-A5 (32-bit, single core) | ARM Cortex-A5 |
| Core Architecture | ARMv7-A with TrustZone and NEON | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 Kbytes | — |
| L1 Data Cache | 32 Kbytes | — |
| L2 Cache / SRAM | 128 Kbytes (configurable as internal SRAM) | — |
| Memory Architecture | MMU (full virtual memory support) | — |
| External Memory Support | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L (16-bit) | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC |
| Flash Interfaces | 2x QSPI, e.MMC | — |
| Packhaging | 196-TFBGA (CSBGA), 11x11 mm, 0.8 mm pitch | 196-TFBGA (11x11 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40 C to +85 C (industrial) | -40C to +85C |
| Supply Voltage (core) | 1.2 V (typ, internal regulator) | — |
| Supply Voltage (I/O) | 3.3 V (typ) | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 |
| Lead-Free / Halogen-Free | Lead-free finish; halogen status [DATA_NEEDED] | — |
| Manufacturer | — | Microchip Technology |
| Series | — | SAMA5D2 |
| Core Count | — | 1 |
| Width ng Data Bus | — | 32-bit |
| Ball Pitch | — | 0.8 mm |
| Co-processors | — | NEON MPE, FPU |
| Backup Mode Current | — | 5 uA (typical) |
| Security Features | — | AES, SHA, TRNG, Secure Boot, Tamper Detection |