ATSAMA5D26A-CN vs ATSAMA5D26B-CN Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D26A-CN sa pamamagitan ng Microchip Technology at ATSAMA5D26B-CN sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
ATSAMA5D26A-CN ATSAMA5D26A-CN - 500MHz ARM Cortex-A5 MPU, 289-LFBGA | Microchip

ATSAMA5D26A-CN - 500MHz ARM Cortex-A5 MPU, 289-LFBGA | Microchip

ATSAMA5D26A-CN ✓ Nakahanda
Microchip Technology
ATSAMA5D26B-CN ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA

ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA

ATSAMA5D26B-CN ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro ATSAMA5D26A-CN ATSAMA5D26B-CN
Brand Microchip Technology Microchip Technology
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Aktibo
MPU Series SAMA5D2 —
Core Architecture ARM Cortex-A5 (32-bit) ARM Cortex-A5 (Armv7-A)
Maximum CPU Clock 500 MHz —
Core Count 1 —
Internal SRAM 128 KB —
External Memory Support DDR2, DDR3L, LPDDR2, LPDDR3 —
Packhaging 289-LFBGA (14x14 mm) 289-LFBGA (14x14 mm)
Ball Count 289 —
Operating Voltage (Core) 1.1 V to 1.32 V —
Operating Voltage (I/O) 1.65 V to 3.6 V —
Ethernet 2x 10/100/1000 GMAC —
USB USB 2.0 Host + Device with PHY —
CAN CAN-FD —
Display Interface LCD controller, up to WXGA resolution —
Security Features ARM TrustZone, AES, SHA, secure boot Secure boot, AES, SHA, TRNG, tamper pins
Hanay ng Temperature na Operasyon -40C to +85C (industrial) -40C to +85C (industrial, -CN grade)
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS Compliant Compliant
Number of Cores — 1
Maksimum na Taktiko ng Oras — 500 MHz
L1 Instruction Cache — 32 kbyte
L1 Data Cache — 32 kbyte
L2 Cache — 128 kbyte (configurable as SRAM)
Memory Management Unit — Yes (MMU)
NEON Media Processing Engine — Yes
Arm TrustZone — Yes
ETM/ETB Support — Yes
DDR Memory Interface — DDR2, DDR3L, LPDDR2, LPDDR3
Flash Memory Interface — QSPI, e.MMC
Backup Mode Current — 5 uA
Peripheral Interfaces — I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC
Embedded Audio Subsystem — Yes
Ball Pitch — 0.8 mm
Level ng MSL — [DATA_NEEDED: MSL level]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita