ATSAMA5D26C-CN vs ATSAMA5D26C-CNR Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng ATSAMA5D26C-CN sa pamamagitan ng Microchip Technology at ATSAMA5D26C-CNR sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
ATSAMA5D26C-CN - Cortex-A5 500MHz MPU, 289-LFBGA | Microchip
ATSAMA5D26C-CN ✓ NakahandaMicrochip Technology
ATSAMA5D26C-CNR - ARM Cortex-A5 MPU 500MHz 289-LFBGA | Microchip
ATSAMA5D26C-CNR ✓ NakahandaPagsanggunian na paghahambing
| Parametro | ATSAMA5D26C-CN | ATSAMA5D26C-CNR |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Microchip Technology | — |
| Series | SAMA5D2 | — |
| Core Processor | ARM Cortex-A5 | — |
| Core Count | 1 | — |
| Bit Width | 32-bit | — |
| Maximum CPU Clock | 500 MHz | — |
| On-chip SRAM | 128 KB | — |
| Backup SRAM | 32 KB (5 uA retention) | — |
| FPU | Yes (single/double precision) | — |
| Packhaging | 289-LFBGA 14x14 mm, 0.8 mm pitch | 289-LFBGA (14x14 mm, 0.8 mm pitch) |
| External Memory Bus | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 | — |
| Flash Interfaces | 2x QSPI, e.MMC, NAND | — |
| Hardware Crypto | AES, SHA, TRNG, secure boot | — |
| Embedded Audio Subsystem | Yes (I2S, class-D amplifier interface) | — |
| Temperature na Operasyon | -40C to +85C (industrial) | — |
| Volte ng Pagbibigay | 1.2 V core (typ) | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Core Architecture | — | ARM Cortex-A5 (32-bit) |
| Maximum Core Clock | — | 500 MHz |
| Number of Cores | — | 1 |
| Instruction Set | — | ARMv7-A with Neon and FPU |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Internal SRAM | — | 128 KB |
| External Memory Support | — | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| Hardware Cryptography | — | AES, SHA, TRNG, secure boot |
| Graphics / LCD | — | Integrated LCD controller (up to WXGA 1280x720) |
| Ethernet | — | 10/100 Mbps EMAC with GMII/RMII/MII |
| USB | — | USB 2.0 High-Speed Host + Device |
| CAN | — | CAN-FD |
| Operating Temperature (Industrial) | — | -40C to +85C |
| Core Supply Voltage | — | 1.2 V (typ) |