DSPB56367AG150 vs DSPA56367AG150 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng DSPB56367AG150 sa pamamagitan ng NXP Semiconductors at DSPA56367AG150 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
DSPB56367AG150 - 150MHz 24-Bit Audio DSP | NXP Semiconductors
DSPB56367AG150 ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | DSPB56367AG150 | DSPA56367AG150 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | DSP | DSP |
| Katayuan ng Lifecycle | Tapus ng Buhay | NRND |
| Core Type | DSP56300 24-bit fixed-point DSP core | — |
| Maksimum na Taktiko ng Oras | 150 MHz | — |
| Program Memory Type | ROM | — |
| Non-Volatile Memory (ROM) | 240 kB | — |
| On-Chip RAM | 69 kB | — |
| Width ng Data Bus | 24 bit | — |
| Interfaces | Host Interface, I2C, SAI, SPI | — |
| Application Type | Audio Processor | — |
| Volte ng Pagbibigay | [DATA_NEEDED: Supply Voltage] | 3.3 V core and I/O |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Packhaging / Kaso | 144-LQFP (20x20 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Terminal Form | Gull Wing | — |
| Packaging | Tray | — |
| Tindminan RoHS | Lead Free (per Mouser listing) | — |
| Qualification | Not Qualified (per Partstack) | — |
| Katayuan ng Lifecycle | End of Life (per NXP product page) | — |
| Architecture | — | DSP56300 family, 24-bit fixed-point |
| Core Frequency | — | 150 MHz |
| Instruction Throughput | — | 150 MIPS |
| Data Word Size | — | 24-bit |
| Program Memory | — | [DATA_NEEDED: on-chip program ROM size] |
| Data Memory | — | [DATA_NEEDED: on-chip data RAM size] |
| External Memory Interface | — | SRAM / SDRAM controller |
| Audio Interfaces | — | ESSI / SAI serial audio ports |
| Host Interface | — | HPI / SCI |
| Packhaging | — | 144-pin LQFP (20x20 mm) |
| Process Technology | — | CMOS |
| Compliance | — | RoHS per NXP product page |
| On-chip Debug | — | OnCE / JTAG |