EP1AGX50CF484C3 vs EP1AGX35CF484C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1AGX50CF484C3 sa pamamagitan ng Intel at EP1AGX35CF484C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1AGX50CF484C3 | EP1AGX35CF484C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | Arria GX | Arria GX |
| Logic Elements | 50,160 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total RAM Bits | 2,475,072 bits | — |
| M4K Memory Blocks | 4,506 | — |
| M-RAM Blocks | 252 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Channels | 12 (up to 3.125 Gbps) | — |
| User I/O Pins | 232 | — |
| Packhaging | 484-ball FBGA (FineLine BGA) | 484-BBGA (FC-FBGA) |
| Speed Grade | C3 (commercial, fastest) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Configuration Method | Passive serial, Fast passive parallel, JTAG | — |
| Tindminan RoHS | Compliant | unknown |
| Process Technology | 90 nm | 90 nm |
| Logic Elements (LE) | — | 33,520 |
| Number of LABs/CLBs | — | 1676 |
| Total Memory Bits | — | 1348416 |
| User I/O Count | — | 230 |
| Number of Transceivers | — | 4 |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Uri ng Pagpapasok | — | Surface Mount |
| Hard IP Support | — | PCI Express, Gigabit Ethernet, Serial RapidIO |