EP1AGX90EF1152I6N vs EP1AGX60EF1152I6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1AGX90EF1152I6N sa pamamagitan ng Intel at EP1AGX60EF1152I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1AGX90EF1152I6N - Arria GX FPGA, 90K LE, FBGA-1152 | Intel
EP1AGX90EF1152I6N ⚠ Huling PagbiliIntel
EP1AGX60EF1152I6N - Arria GX 60 FPGA, 60K LE, 1152-BGA | Intel / Altera
EP1AGX60EF1152I6N ObsoletePagsanggunian na paghahambing
| Parametro | EP1AGX90EF1152I6N | EP1AGX60EF1152I6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Arria GX | Arria GX FPGA |
| Logic Elements (LE) | 90,000 | 60,100 |
| Configurable Logic Blocks (CLBs) | 90,220 | — |
| Logic Array Blocks (LABs) | 4,511 | — |
| Maximum User I/O | 538 | — |
| Embedded Memory | 4,510 Kbits | 2,528,640 bits (≈2.4 Mbit) |
| Transceiver Channels | 4 | 12 (3.125 Gbps, embedded CDR/SERDES) |
| Transceiver Data Rate | 1.25 to 3.125 Gbps | — |
| Core Voltage | 1.2 V | — |
| Packhaging | FBGA-1152 (35x35 mm, 1.0 mm pitch) | 1152-BBGA (FBGA-1152, 35 × 35 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40 °C to +100 °C (Industrial, suffix I) |
| Lead-Free / RoHS | Yes (Lead Free) | — |
| Process Technology | 90 nm | — |
| Maximum Frequency | 640 MHz (internal) | — |
| Series | — | Arria GX |
| LABs / CLBs | — | 3,005 |
| Total RAM Bits | — | 2,528,640 |
| User I/O Count | — | 514 |
| 18 × 18 Hardware Multipliers | — | 252 |
| PLLs | — | 4 (one per quadrant) plus transceiver PLLs |
| Speed Grade | — | 6 |
| Process Node | — | 90 nm |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT/VCC typical value] |
| Hard IP | — | PCI Express ×1/×4, Gigabit Ethernet MAC, 8B/10B encoder/decoder |
| Memory Interfaces | — | DDR, DDR2, QDRII, RLDRAM (external memory controller) |
| Tindminan RoHS | — | Compliant (per distributor listing) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |