EP1C12F256C6N vs EP1C12F256C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C12F256C6N sa pamamagitan ng Intel at EP1C12F256C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera
EP1C12F256C6N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1C12F256C6N | EP1C12F256C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Cyclone® | Cyclone I (EP1C12) |
| Logic Elements (LEs) | 12,060 | 12,060 |
| Logic Array Blocks (LABs) | 1,206 | 1,206 |
| Embedded Memory Bits | 239,616 bits | — |
| M4K RAM Blocks | 52 | — |
| Embedded 18x18 Multipliers | Yes | — |
| PLLs | 2 | 2 |
| Maximum User I/O | 185 | — |
| User I/O Banks | [DATA_NEEDED: number of user I/O banks] | — |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | 1.5 V to 3.3 V (bank-dependent) |
| Process Technology | 0.13 µm SRAM | 130 nm |
| Packhaging | 256-ball FBGA (F256) | 256-ball FineLine BGA (FBGA-256) |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | 0C to +85C (Commercial, 'C' suffix) |
| Speed Grade | 6 | 7 |
| Configuration Method | Serial (EPCS) / JTAG | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: confirm from product page] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone |
| Total RAM Bits | — | 239,616 |
| Embedded Multipliers (18x18) | — | 52 |
| User I/O Pins | — | 185 |
| Number of I/O Banks | — | 4 |
| Configuration Mode | — | PS / AS / JTAG |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: confirm] |
| Level ng MSL | — | [DATA_NEEDED: confirm] |