EP1C12F256C8 vs EP1C12F256I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C12F256C8 sa pamamagitan ng Intel at EP1C12F256I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C12F256C8 | EP1C12F256I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Series | Cyclone | — |
| Family | Cyclone I | Cyclone (1st generation) |
| Logic Elements (LE) | 12,060 | — |
| Total RAM Bits | 239,616 | 239,616 |
| Number of LABs/CLBs | 1,206 | — |
| Number of Logic Elements/Cells | 12,060 | — |
| Number of I/O | 185 | — |
| Number of PLLs | 2 | 2 |
| Total Memory Bits | 239,616 | — |
| Packhaging / Kaso | 256-BGA (FBGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0°C to +85°C (commercial grade) | — |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Voltage Range | 1.5 V to 3.3 V | — |
| Supplier Device Package | 256-FBGA (17x17 mm) | — |
| Process Technology | 130 nm SRAM | 130 nm |
| Configuration Method | Passive Serial / Active Serial / JTAG | — |
| Logic Elements | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Embedded Memory Blocks | — | M4K (4,608 bits each) |
| User I/O Count | — | 185 |
| Packhaging | — | 256-ball FBGA (FineLine BGA) |
| Package Dimensions | — | 17 mm x 17 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | 7 |
| Tindminan RoHS | — | Compliant |