EP1C6F256C6 vs EP1C6F256C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C6F256C6 sa pamamagitan ng Intel at EP1C6F256C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C6F256C6 | EP1C6F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Cyclone | Cyclone |
| Logic Elements | 5,980 | — |
| Logic Array Blocks (LABs) | 598 | 598 |
| Total RAM Bits | 92,160 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| User I/O Pins | 185 | 185 |
| PLLs | 2 | 2 |
| Core Voltage | 1.5 V | 1.5 V |
| Speed Grade | C6 | 6 |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Packhaging | 256-ball FineLine BGA (FBGA) | 256-BGA (FBGA-256) |
| Package Dimensions | 17 mm × 17 mm | — |
| Process Technology | 0.13 µm SRAM | 0.13 µm SRAM |
| Configuration Method | JTAG, serial (EPCS), passive serial | JTAG / Active Serial |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (Pb-free) |
| Logic Elements (LEs) | — | 5,980 |
| Embedded RAM Bits | — | 92,160 |
| I/O Standards | — | LVTTL, LVCMOS, SSTL, LVDS |