EP1C6T14417N vs EP1C6T144C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C6T14417N sa pamamagitan ng Intel at EP1C6T144C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C6T14417N | EP1C6T144C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Family | Cyclone | Cyclone I |
| Logic Elements | 5,980 | — |
| Total RAM Bits | 92,160 | 92,160 |
| Embedded M4K RAM Blocks | 20 | — |
| Maximum User I/O Pins | 185 | — |
| PLLs | 2 | 2 |
| Global Clock Networks | 20 | — |
| LVDS Channels | 34 differential pairs (max) | — |
| Core Voltage (VCCINT) | 1.5 V (typical) | 1.425 V to 1.575 V (typ. 1.5 V) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0°C to +85°C (commercial) |
| Speed Grade | 7 (-7) | C8 (commercial) |
| Packhaging | TQFP-144 (1.0 mm pitch) | 144-pin TQFP |
| Configuration Mode | Active Serial (AS) / Passive Serial (PS) / JTAG | — |
| Process Technology | 130 nm TSMC | 0.13 µm all-layer copper SRAM |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone® |
| Logic Elements (LE) | — | 5,980 |
| Logic Array Blocks (LAB) | — | 598 |
| User I/O Pins | — | 98 |
| Number of I/O Banks | — | 4 |
| Maximum Internal Frequency | — | 275 MHz |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Method | — | Active Serial (EPCS), Passive Serial, JTAG |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |