EP1K100FI256-2 vs EP1K100FI256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K100FI256-2 sa pamamagitan ng Intel at EP1K100FI256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K100FI256-2 | EP1K100FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX 1K | ACEX 1K |
| Series | EP1K100 | EP1K100 |
| Logic Elements / Cells | 4,992 | — |
| System Gates | 100,000 | 100,000 |
| Number of LABs/CLBs | 624 | — |
| Total RAM Bits | 49,152 | 49,152 |
| Number of I/O | 186 | — |
| Number of Gates | 257,000 | — |
| Voltage - Supply | 2.5 V | — |
| Temperature na Operasyon | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 256-BGA (FineLine BGA, FBGA-256) | — |
| Speed Grade | -2 (mid-range) | -2 (faster bin) |
| Max Frequency | 250 MHz | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (leaded 'N' ball finish) |
| Logic Elements | — | 4,992 |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Array Blocks (EABs) | — | 6 |
| Maximum User I/O | — | 186 |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Ball Finish | — | Leaded (SnPb) - 'N' suffix |
| Packhaging | — | 256-ball FineLine BGA (FBGA-256) |
| Configuration Interface | — | JTAG (IEEE 1149.1) + serial modes |