EP1K10FC256-2N vs EP1K10FI256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K10FC256-2N sa pamamagitan ng Intel at EP1K10FI256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1K10FC256-2N - 10K Gate ACEX-1K FPGA 576 LE 256-BGA | Intel / Altera
EP1K10FC256-2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1K10FC256-2N | EP1K10FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | ACEX-1K | — |
| Family Name | ACEX-1K | — |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Typical Gates | 10,000 | 10,000 |
| Logic Elements / Cells | 576 | — |
| Number of LABs/CLBs | 72 | — |
| Total RAM Bits | 12,288 | 12,288 |
| Number of I/O | 136 | — |
| Number of Gates | 56,000 (maximum) | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| Pin-to-Pin Logic Delay | 0.5 ns | — |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 256-BBGA (FineLine BGA, 17 mm × 17 mm) | — |
| Supplier Device Package | 256-FBGA | — |
| Tindminan RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead Time | To be confirmed by distributor | — |
| Family | — | ACEX 1K |
| Logic Elements (Cells) | — | 576 |
| Embedded Array Blocks (EABs) | — | 3 (12,288 RAM bits) |
| User I/O Count | — | 136 |
| Core Voltage | — | 2.5 V |
| Process Technology | — | 0.22 µm CMOS |
| Speed Grade | — | -2 |
| Maximum Internal Frequency | — | 200 MHz |
| Packhaging | — | 256-Ball FBGA (FineLine BGA, 1.0 mm pitch) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |