EP1K10FC256-3N vs EP1K10FI256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K10FC256-3N sa pamamagitan ng Intel at EP1K10FI256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K10FC256-3N | EP1K10FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | ACEX-1K | ACEX 1K |
| Typical Gates | 10,000 | 10,000 |
| Logic Elements | 576 | — |
| LABs / CLBs | 72 | — |
| Embedded RAM Bits | 12,288 (12 Kbit) | — |
| User I/O Pins | 136 | — |
| Packhaging | 256-ball FBGA (17 mm × 17 mm) | 256-Ball FBGA (FineLine BGA, 1.0 mm pitch) |
| Core Voltage | 2.5 V | 2.5 V |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Speed Grade | -3 | -2 |
| Configuration Method | SRAM (volatile), external PROM or JTAG | — |
| Temperature na Operasyon | Commercial (0 °C to +70 °C) | -40 °C to +85 °C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Logic Elements (Cells) | — | 576 |
| Embedded Array Blocks (EABs) | — | 3 (12,288 RAM bits) |
| Total RAM Bits | — | 12,288 |
| User I/O Count | — | 136 |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |