EP1K10FI256-2N vs EP1K30FI256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K10FI256-2N sa pamamagitan ng Intel at EP1K30FI256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K10FI256-2N | EP1K30FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | ACEX 1K | ACEX-1K |
| Logic Elements (Cells) | 576 | — |
| Typical Gates | 10,000 | 30,000 |
| Embedded Array Blocks (EABs) | 3 (12,288 RAM bits) | — |
| Total RAM Bits | 12,288 | — |
| User I/O Count | 136 | — |
| Core Voltage | 2.5 V | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Speed Grade | -2 | -2 |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Packhaging | 256-Ball FBGA (FineLine BGA, 1.0 mm pitch) | 256-ball FineLine BGA (FBGA) |
| Temperature na Operasyon | -40 °C to +85 °C (Industrial) | — |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Elements (LEs) | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| Maximum User I/O | — | 171 |
| Core Supply Voltage | — | 2.5 V |
| Number of LABs | — | 216 |
| Operating Temperature Grade | — | Industrial |
| Programmable via | — | JTAG (IEEE 1149.1) |
| Uri ng Memory | — | Dual-port Embedded Array Block (EAB) |