EP1K30F256-3 vs EP1K100FI256-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30F256-3 sa pamamagitan ng Altera at EP1K100FI256-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K30F256-3 | EP1K100FI256-2 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | ACEX 1K | ACEX 1K |
| Logic Elements | 1,728 | — |
| Equivalent Gates | 30,000 | — |
| Configurable Logic Blocks (CLBs) | 216 | — |
| Embedded Memory (RAM bits) | 24,576 | — |
| Maximum User I/O Pins | 171 | — |
| Maksimum na Taktiko ng Oras | 909 MHz | — |
| Speed Grade | -3 | -2 (mid-range) |
| Core Voltage | 1.8 V | — |
| Process Technology | 0.18 µm CMOS SRAM | 0.22 µm CMOS |
| Packhaging | FBGA-256 (FineLine BGA) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM (requires external configuration device) | — |
| JTAG Support | Yes (IEEE 1149.1 / IEEE 1532) | — |
| PLL | Yes (on-chip) | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40 °C to +85 °C (Industrial) |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Series | — | EP1K100 |
| Logic Elements / Cells | — | 4,992 |
| System Gates | — | 100,000 |
| Number of LABs/CLBs | — | 624 |
| Total RAM Bits | — | 49,152 |
| Number of I/O | — | 186 |
| Number of Gates | — | 257,000 |
| Voltage - Supply | — | 2.5 V |
| Packhaging / Kaso | — | 256-BGA (FineLine BGA, FBGA-256) |
| Max Frequency | — | 250 MHz |